WS512K32N-25H1MA
Vendor: Microsemi Corporation
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Manufacturer No:
Microsemi Corporation
Category:
SRAMs
Detailed Description:
SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Package:
PGA
Data Sheet:
Datasheet
Product Status:
Transferred
inventory:4845
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IC 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CHIP, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66, Static RAM
Cobham Power Products
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66
Cobham Power Products
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66
Microsemi Corporation
SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Cobham PLC
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66
Mercury Systems Inc
SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Cobham PLC
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.085 X 1.085 INCH, 0.185 INCH HEIGHT, PGA-66
Microsemi Corporation
SRAM Module, 512KX32, 35ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
White Electronic Designs Corp
SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Twilight Technology Inc
SRAM Module, 512KX32, 30ns, CMOS, J LEAD, STACK, SLCC-68
White Microelectronics
SRAM Module, 512KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68
Microsemi Corporation
SRAM Module, 512KX32, 85ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Microsemi Corporation
SRAM Module, 512KX32, 15ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Twilight Technology Inc
SRAM Module, 2MX8, 120ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
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